MUT 2017 took place in Glasgow, UK
16th International Workshop on Micromachined Ultrasonic Transducers took place in 28-29th June 2017 in Glasgow, UK.
The 16th MUT conference is hosted by the Centre for Ultrasonic Engineering at the University of Strathclyde, Glasgow, UK.
This year two publications are presented in MUT, which are;
‘Integrated Receiver Electronics for a CMUT Array’ authored by Yavuz Kansu and ‘The Effect of Insulator Charging on CMUT Performance’ authored by Prof. Hayrettin Köymen.
TIA chip is worked as expected
TIA chip is functioning as expected. The photo below is taken by a microscope after bonding.
TIA Design manufactured by AMS foundry is received
A chip consisting of 128 transimpedance amplifiers is submitted (18 April 2016) to AMS foundry through Europractice. The transimpedance amplifiers are to be interfaced with 128 CMUT cells. The chip was designed by Yavuz Kansu, Cem Bülbül and Abdullah Atalar. It has a size of 6050μm x 1140μm. Only 4 amplifiers will be active at a given time, selected by 5 digital lines. The chip has four driver amplifiers to be able to drive transmission lines to DiPhAS. The chip is currently in testing phase.
UFFC 2016 took place in Tours, France (18-21 Sept. 2016)
UFFC 2016 took place in Tours, France. Recent publication, ‘Tuning of cMUT Receiver Arrays’, authored by A. Sinan Taşdelen, is presented.
DiPhAS from Fraunhofer Institute is delivered
DiPhAS ordered from Fraunhofer Institute in Germany with funding from TUBITAK project is delivered.
